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Point2 attracts Maverick Silicon, Nvidia to funding round for data centre interconnect plans
GLOBAL 07:34

Point2 attracts Maverick Silicon, Nvidia to funding round for data centre interconnect plans

Point2 Technology, a developer of RF-based interconnect products for data centre infrastructure, announced an extension of its Series B round led by Maverick Silicon, with participation from NVentures (Nvidia's venture capital arm) and UMC Capital, bringing total Series B funding to USD 76 million. The funding will support development and deployment of its Active RF Cable (ARC) platform, as well as future e-Tube products for next-generation rack-scale compute systems. The company said it is expanding its en

Arm CEO adds new international role at Softbank
GLOBAL 07:12

Arm CEO adds new international role at Softbank

Rene Haas, the CEO of Arm, is taking on a new position at parent company Softbank Group. Effective 21 April he becomes CEO of Softbank Group International, an operating unit that oversees some of the Japanese group's international subsidiaries. Haas will work on coordinating companies across the group focused on semiconductors and AI, "with the aim of further enhancing operational efficiency", Softbank said. At the same time he remains CEO of Arm and a member of the Softbank board. 

Dutch AI chip startup Euclyd in talks for EUR 100 mln in funding
NETHERLANDS 20 APR

Dutch AI chip startup Euclyd in talks for EUR 100 mln in funding

Dutch startup Euclyd is in talks with investors to raise at least EUR 100 million for developing its AI chip technology and bringing its product to market. Started in 2024 by Bernardo Kastrup and supported by former ASML CEO Peter Wennink, the company will use the cash to scale up production and serve its first clients, Kastrup told CNBC.

LG Innotek wins USD 68 mln order for Wi-Fi 7 chips for carmaker
EUROPE 20 APR

LG Innotek wins USD 68 mln order for Wi-Fi 7 chips for carmaker

LG Innotek announced a contract to supply its automotive Wi-Fi 7 communication module to a leading European automotive parts company. The order is worth approximately USD 68 million, with mass production set to begin in 2027. The Wi-Fi module will be used in audio, video and navigation systems provided to an unnamed global carmaker. The deal represents a strong vote of confidence in LG's new automotive business launched last year.

Component shortages to limit general server growth - TrendForce
GLOBAL 20 APR

Component shortages to limit general server growth - TrendForce

Market analyst TrendForce has revised its outlook for the global server market, forecasting shipment growth of around 13 percent year-on-year in 2026, citing component shortages and extended lead times affecting general-purpose systems. Suppliers are increasingly prioritising production capacity for higher-margin AI servers, leading to constraints in key components used in general servers. Lead times for items such as printed circuit boards and CPUs have stretched to close to one year, while delays for powe

Silicom wraps up design win with European secure communications provider
EUROPE 16 APR

Silicom wraps up design win with European secure communications provider

Silicom has announced its latest design win as a European provider of encrypted and secure communications picked its FPGA-based SmartNIC network interface card (NIC) technology, following a positive evaluation of an off-the-shelf model. Silicom will now proceed with building a customised FPGA SmartNIC to fit the customer's precise criteria. Silicom said commitments worth about USD 1 billion had been agreed, with the possibility of collection towards the second half of 2026. The full booking is anticipated t

Sivers Semiconductors to raise SEK 125 mln in directed share issue, mulls listing on Nasdaq New York
GLOBAL 16 APR

Sivers Semiconductors to raise SEK 125 mln in directed share issue, mulls listing on Nasdaq New York

Sivers Semiconductors has announced plans for a directed share issue to raise approximately SEK 125 million and also said it is considering a potential dual listing of its stock on Nasdaq New York alongside Nasdaq Stockholm. The directed issue responds to "significant" demand from long-term institutional investors who share the board's confidence in Sivers Semiconductors' strategic direction and growth potential, it said.

Meta unveils Broadcom tie-up to power AI training and inference chips
GLOBAL 15 APR

Meta unveils Broadcom tie-up to power AI training and inference chips

Meta has announced an expanded collaboration with Broadcom to deliver custom silicon chips in its data centre racks, bringing greater bandwidth and compute capacity to help scale up AI training and inference. The partnership covers Meta Training and Inference Accelerator (MTIA) chips, Meta's silicon pipeline for AI data centres and AI workloads initially introduced in 2023. Broadcom said the project would focus on tighter integrations of logic, memory and high-speed input and output (I/O) components, unlock

Italian govt backs 2D Photonics with EUR 211 mln grant to boost AI chip interconnects
ITALY 15 APR

Italian govt backs 2D Photonics with EUR 211 mln grant to boost AI chip interconnects

Italian startup 2D Photonics Group has secured approval from the European Commission for a EUR 211 million grant from the Italian state to develop graphene-based optical technology aimed at speeding up processing at artificial intelligence data centres. The company's innovation, led by its research arm CamGraPhIC, seeks to enable faster data flows between chips and memory components while sharply cutting power consumption and latency.

Snap and Qualcomm clinch deal to power future Specs products with Snapdragon XR chip
GLOBAL 13 APR

Snap and Qualcomm clinch deal to power future Specs products with Snapdragon XR chip

Qualcomm said it will supply Snap's Specs subsidiary with its extended reality system-on-chip (SoC) to empower a future-generation smart glasses product that seamlessly blends digital experiences with the physical world using see-through lenses. The product, also called Specs, is scheduled to launch later in the year. It follows the incorporation of Snap's dedicated Specs business unit in January.

SKT partners Arm and Rebellions on AI infrastructure for data centres
KOREA, REPUBLIC OF 10 APR

SKT partners Arm and Rebellions on AI infrastructure for data centres

SK Telecom (SKT) has announced a strategic partnership with Arm and Rebellions to develop AI inference infrastructure aimed at telecommunications and sovereign AI data centre deployments. The collaboration will focus on building a server architecture combining Arm's AGI CPU with Rebellions' RebelCard neural processing unit, with the system to be tested in SKT's AI data centre environment. The companies said the approach is designed to support large-scale AI inference workloads by combining general-purpose p

Intel and Google expand partnership on AI and custom processing units
GLOBAL 10 APR

Intel and Google expand partnership on AI and custom processing units

Intel Corporation and Google have announced a multiyear collaboration to develop AI and cloud infrastructure, focusing on the role of CPUs and custom infrastructure processing units in large-scale systems. Under the agreement, Intel Xeon processors will continue to be deployed across Google Cloud infrastructure to support AI, inference and general-purpose workloads. The companies said they will align across multiple generations of Xeon processors to improve performance, energy efficiency and overall cost of

GLOBAL 9 APR

Nvidia's Rubin delays mean Blackwell to dominate 2026 AI GPU shipments

Nvidia's high-end AI GPU shipment mix is expected to shift significantly in 2026, with the Blackwell architecture forecast to account for more than 70 percent of shipments, according to analysts TrendForce. The change comes amid delays affecting newer platforms and ongoing supply chain and geopolitical uncertainties. Combined share of the Hopper and Rubin series will decline as a proportion of total high-end GPU shipments. Blackwell is projected to increase its share from 61 percent to 71 percent, consolida

GLOBAL 7 APR

Samsung flags record Q1 earnings amid chip recovery

Samsung Electronics has issued earnings guidance for the first quarter of 2026, indicating a sharp increase in both revenue and operating profit, driven by a recovery in the semiconductor market. The company expects revenue of approximately KRW 133 trillion and operating profit of around KRW 57.2 trillion. The guidance marks a substantial rise compared with the same period a year earlier, when Samsung reported revenue of KRW 79.14 trillion and operating profit of KRW 6.69 trillion. It also exceeds the compa

GLOBAL 7 APR

Anthropic adds cloud capacity with Google, Broadcom as revenues pass USD 30 billion

Anthropic announced new cloud computing deals with Google and Broadcom to support the rapid expansion in its AI business. The news comes as its revenue run rate has tripled since the end of 2025, to over USD 30 billion in annualised sales from USD 9 billion in December. 

GLOBAL 3 APR

Broadcom names Alphabet accounting officer as CFO from 12 June

Broadcom has appointed Alphabet chief accounting officer Amie Thuener to serve as its next chief financial officer starting 12 June. Hock Tan, Broadcom's president and chief executive, indicated Thuener would offer extensive insights across her new remit, drawing on substantial experience in financial reporting, corporate governance and AI-related transactions. Thuener's selection for the CFO brief comes as the current incumbent Kirsten Spears has tendered her resignation. Spears will remain as an adviser u

GLOBAL 3 APR

Zoom COO joins Intel

Aparna Bawa, the chief operating officer at Zoom Communications, is moving to Intel from May to become EVP, chief legal and people officer. Bawa will report directly to CEO Lip-Bu Tan and will lead Intel's global legal, ethics, compliance, people, and culture organisations. 

IRELAND 2 APR

Intel buys back stake in Irish fab from Apollo for USD 14 billion

Intel has agreed to buy back the 49 percent of its factory in Ireland sold to Apollo less than two years ago. Intel agreed to sell the 49 percent in Fab 34 for USD 11.0 billion, and now will buy it back from the investor for USD 14.2 billion. The move underlines the shift in strategy at Intel since its new CEO took over a year ago and a strengthened balance sheet at the chipmaker after attracting other new investors. 

GLOBAL 2 APR

Memory price surge to impact smartphones, consumer devices in Q2

Rising demand from AI and cloud infrastructure is expected to drive significant increases in memory prices in the second quarter of 2026, with implications across telecom-related end markets including smartphones, consumer devices and data centre services, according to analysis from TrendForce. Contract prices for DRAM will increase by 58-63 percent quarter-on-quarter, while NAND flash prices are expected to rise by 70-75 per cent, as suppliers prioritise higher-margin server and AI-related applications.

GLOBAL 1 APR

Nvidia and Marvell expand partnership to target AI and telecom infrastructure

Nvidia and Marvell Technology have announced an expanded strategic partnership focused on AI infrastructure, including applications in telecommunications networks. The agreement will integrate Marvell's technologies into Nvidia's NVLink Fusion platform, enabling customers to build semi-custom AI infrastructure compatible with Nvidia's broader ecosystem. Under the arrangement, Marvell will supply custom processing units and networking technologies, while Nvidia will provide components including CPUs, network

GLOBAL 31 MRT

EnSilica takes up key role in UK's Cheri secure microchips project

Fabless ASIC vendor EnSilica has confirmed its participation in a UK government-backed silicon project aimed at embedding microchip-hosted security protections into critical infrastructure and IT systems. The UK's CHERI Adoption Collective is spearheaded by PA Consulting in partnership with the UK's Department for Science, Innovation & Technology. Participants in the initiative, awarded GBP 24 million from the UK's Industrial Strategy in June 2025, include BT and fellow infrastructure operators National Gri

GLOBAL 30 MRT

Airoha Technology ramps up prplOS silicon roadmap for fibre broadband CPE

MediaTek's Airoha Technology has revealed that two of its fibre broadband chipsets certified to run open source prplOS software entered mass deployment during 2025. Airoha intends to further expand prplOS support to four additional fibre silicon platforms in 2026, having won support from ecosystem players including CPE software specialist SoftAtHome. 

GLOBAL 30 MRT

Sivers targets frontier 5G-A, 6G transmitters with new beamforming IC

Sivers Semiconductors announced the general release of a beamforming integrated circuit (IC) chip for directed signal transmission in FR3 bands, supporting frontier 5G Advanced and 6G network deployments. Sivers' Daybreak 0715 beamforming IC is designed to capture superior propagation associated with sub-6 GHz frequencies but delivered using wider, upper mid-band bandwidths from 7-15 GHz. The FR3 bands, nestled between sub-6 GHz and existing mmWave spectrum, are under consideration to provide incremental ca

UNITED STATES 27 MRT

Lumentum acquires Qorvo's North Carolina fab to produce 6-inch InP wafers

Lumentum has bought Qorvo's former US fabrication plant in Greensboro, North Carolina. The 240,000 square foot (22,300 square metre) site will be retrofitted to produce 6-inch indium phosphide (InP) wafer components for Lumentum's optical devices targeted at AI infrastructure and hyperscale data centres, including continuous wave and ultra-high-power (UHP) lasers. Production is expected to scale up towards mid-2028.

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The week in telecoms: Samsung profits soar, Netflix targets kids and telcos build defence vertical

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