US, Taiwan strike USD 500 billion semiconductor trade agreement
TAIWAN 08:38

US, Taiwan strike USD 500 billion semiconductor trade agreement

The American Institute in Taiwan and the Taipei Economic and Cultural Representative Office in the US have signed a trade deal designed to reshore America's semiconductor sector. The US Department of Commerce said it expects this commitment of investment from Taiwan to strengthen US economic resilience, create high-paying jobs, and increase national security. Taiwanese semiconductor and technology enterprises will make new, direct investments totaling at least USD 250 billion to build and expand semiconduct

MediaTek updates flagship range with Dimensity 9500s, 8500 chips
GLOBAL 15 JAN

MediaTek updates flagship range with Dimensity 9500s, 8500 chips

MediaTek is expanding its range of processors for flagship-class smartphones with the new Dimensity 9500s and Dimensity 8500 chips. These products focus on delivering outstanding performance, efficiency, AI, imaging, gaming and wireless connectivity for the latest generation of premium phones. No word was provided on the customers for the new processors. 

Korea, Netherlands to deepen chip, quantum R&D ties
KOREA, REPUBLIC OF 14 JAN

Korea, Netherlands to deepen chip, quantum R&D ties

South Korea and the Netherlands have agreed to strengthen cooperation in semiconductor and quantum technology development following the fourth Korea-Netherlands Innovation Joint Committee, held in The Hague on 14 January. The meeting was convened by South Korea's ministry of trade, industry and energy and the Dutch ministry of economic affairs. The two governments signed a letter of intent to expand collaboration in semiconductors and quantum technologies, citing both countries' technical capabilities and t

RANsemi and Radisys develop 5G platform for mission-critical use
GLOBAL 13 JAN

RANsemi and Radisys develop 5G platform for mission-critical use

UK wireless semiconductor RANsemi Limited and telecom software company Radisys Corporation said they are expanding their relationship and will develop next-generation 5G products for tactical and mission-critical communications. They are bringing together RANsemi's software-defined baseband platforms and Radisys' 3GPP Release 18-compliant 5G RAN and Core software in order to offer secure, resilient and rapidly deployable 5G systems for defence, security and public safety environments. Radisys supports 5G RA

Worldwide semiconductor revenue grew 21% in 2025 - Gartner
GLOBAL 13 JAN

Worldwide semiconductor revenue grew 21% in 2025 - Gartner

Worldwide semiconductor revenue totalled USD 793 billion in 2025, an increase of 21 percent YoY, according to preliminary results from analysts Gartner. The firm said AI semiconductors – including processors, high-bandwidth memory (HBM), and networking components continued to drive "unprecedented growth" in the semiconductor market, accounting for nearly one-third of total sales in 2025. This domination is set to rise as AI infrastructure spending is forecast to surpass USD 1.3 trillion in 2026.

IQE expects FY sales in upper forecast range, reports non-binding takeover interest
GLOBAL 12 JAN

IQE expects FY sales in upper forecast range, reports non-binding takeover interest

IQE, a London-listed supplier of epitaxial wafers for compound semiconductors, said in a trading update it now expects full-year sales and earnings to finish at the higher end of its prior guidance. The company calculates turnover will arrive at around GBP 97 million, above the midpoint of its revised GBP 90 -100 million estimate, while adjusted EBITDA will finish at GBP 2 million or greater. IQE had projected the latter metric to range from a GBP 5 million loss to a GBP 2 million profit.

Keysight tests NR-NTN link in band n252 using Samsung modem chipset
GLOBAL 9 JAN

Keysight tests NR-NTN link in band n252 using Samsung modem chipset

Keysight Technologies said it has achieved a new radio non-terrestrial networks (NR-NTN) connection in band n252 using Samsung Electronics' next-generation modem chipset. The demonstration took place at CES 2026 in Las Vegas and included live satellite-to-satellite (SAT-to-SAT) mobility using commercial-grade modem silicon and cross-vendor interoperability. The n252 band is expected to be adopted by next-generation low Earth orbit (LEO) constellations and this validation follows those for n255 and n256.

Nvidia changes delay high bandwidth memory mass production - TrendForce
GLOBAL 9 JAN

Nvidia changes delay high bandwidth memory mass production - TrendForce

Specification changes and strong Blackwell demand at Nvidia will delay high bandwidth memory 4 means production until  the end of 1Q26, according to analysts TrendForce. Nvidia has revised the HBM4 specifications for its new Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps. This change has necessitated that the three major HBM suppliers modify their designs.

Hyundai Mobis and Qualcomm to co-develop SDV and ADAS architecture
GLOBAL 8 JAN

Hyundai Mobis and Qualcomm to co-develop SDV and ADAS architecture

Hyundai Mobis and Qualcomm Technologies have signed a comprehensive agreement to collaborate on software-defined vehicle (SDV) architecture and advanced driver assistance systems (ADAS), formalised at CES 2026 in Las Vegas. Under the agreement, the companies will co-develop integrated automotive solutions with an initial focus on emerging markets, alongside plans to pursue broader global supply opportunities. The collaboration combines Hyundai Mobis's capabilities in system integration, sensor fusion and pe

Samsung expects Q4 operating profit to triple due to AI chip boom
GLOBAL 8 JAN

Samsung expects Q4 operating profit to triple due to AI chip boom

Samsung Electronics has forecast its highest-ever quarterly operating profit of KRW 20 trillion (USD 13.8 billion) for the fourth quarter, after soaring memory prices and a steep rise in orders for high-bandwidth memory (HBM) chips driven by global demand for AI infrastructure. The operating profit saw a more than 200 percent rise from a year earlier. Sales increased 22.7 percent to KRW 93 trillion. It was also the first time for the quarterly sales to surpass the KRW 90 trillion mark. The operating profit

GCT marks commercial deliveries of 5G RF chipset
GLOBAL 7 JAN

GCT marks commercial deliveries of 5G RF chipset

GCT Semiconductor announced it has completed the inaugural batch of commercial 5G chipset shipments to its customers. This milestone follows sample 5G deployments with multiple clients in late 2025, including a contract with Airspan and Gogo targeting 5G air-to-ground connectivity in North American air flights.

Broadcom expands Wi-Fi 8 silicon line up with dual-band AP entries and compute accelerator unit
GLOBAL 7 JAN

Broadcom expands Wi-Fi 8 silicon line up with dual-band AP entries and compute accelerator unit

Broadcom has been previewing its next-generation Wi-Fi silicon line-up at the Consumer Electronics Show in Las Vegas. The firm is showcasing two chips for dual-band Wi-Fi 8 AP devices, the BCM6714 and BCM6719, as well as a compute acceleration unit for the next wave of Wi-Fi, the BCM4918 APU. Together, the products represent key pillars in Broadcom's plan to market a unified Wi-Fi 8 platform, giving operators a shortcut to delivering on-device AI acceleration for residential customers with security and powe

GLOBAL 7 JAN

Marvell to acquire XConn to strengthen data centre switching portfolio

Marvell Technology has agreed to acquire XConn Technologies in a transaction valued at approximately USD 540 million, expanding its presence in PCIe and Compute Express Link (CXL) switching silicon used in AI data centre infrastructure. The deal is expected to close in early 2026, subject to regulatory approvals and customary conditions. XConn develops PCIe and CXL switch silicon and brings an established product portfolio and engineering team to Marvell. Its PCIe 5 and CXL 2.0 switches are already in produ

GLOBAL 6 JAN

Sony's Altair unit pushes 5G eRedCap modem project to prepare for cellular IoT transition

Sony Semiconductor Israel has announced plans to commercialise wireless IoT chips powered by the 5G enhanced reduced capability (eRedCap) standard. Sony is publicising the roadmap for its upcoming 5G eRedCap modem, the Altair ALT1550 5G, and says it believes the future of IoT is clearly converging around eRedCap as device makers seek efficient means of facilitating 4G to 5G transitions over the next 10-20 years. ALT1550 5G is currently undergoing physical silicon testing, and will also support 4G/LTE-based

GLOBAL 6 JAN

Infinix to launch Note Edge with MediaTek Dimensity 7100 and XOS 16 on 19 January

Infinix has announced the launch of the Infinix Note Edge on 19 January and said it will be the world's first smartphone to adopt the new MediaTek Dimensity 7100. The new system-on-a-chip platform accompanies the debut of Infinix's first in-house Android 16-based operating system, called XOS 16. The aim is to offer a 5G product that is accessible at 4G-level pricing, the company said.

PORTUGAL 6 JAN

Portugal commits EUR 6.4 million to microelectronics projects

Portuga's National Innovation Agency (ANI) committed EUR 6.4 million to two strategic microelectronics projects. Led by the International Iberian Nanotechnology Laboratory (INL) and the Telecommunications Institute (IT), this funding supports Portugal's involvement in European Chips Joint Undertaking Partnership (CHIPS JU) projects, a key component of the European Chips Act. This initiative is a crucial step in implementing Portugal's National Semiconductor Strategy, aiming to bolster the country's technolo

GLOBAL 6 JAN

Qualcomm launches AIoT-focused Dragonwing chips and platform updates

Qualcomm has announced further additions to its Dragonwing silicon ecosystem, adding new chips targeting enriched AIoT use cases as well as platform enhancements to integrate assets from earlier acquisition deals. The new Dragonwing Q-8750 is billed as Qualcomm's most advanced IoT processor yet. Engineered for performance edge compute and immersive experiences, the silicon platform incorporates a 77 TOPS (tera operations per second) AI engine that can be configured to run FP16 floating point precision calcu

GLOBAL 6 JAN

MediaTek unveils Wi-Fi 8 chips for release later this year

MediaTek introduced the Filogic 8000 family of Wi-Fi 8 chips at CES. The new range is designed to deliver "ultra-high" reliability across broadband gateways and enterprise access points as well as client devices like smartphones, laptops, TVs, streaming devices and tablets. The first chips will cater to premium and flagship devices with Wi-Fi 8, with shipments to customers expected to start later this year. 

GLOBAL 6 JAN

Qualcomm extends laptop line with Snapdragon X2 Plus

Snapdragon is expanding its range of laptop chips with the new Snapdragon X2 Plus. Designed for Windows 11 devices running Copilot and other AI applications, the chip will be available in devices from leading OEMs later in the first half of 2026. Aimed at professionals, creators or even everyday users, these PCs will feature long battery life, fast performance and fluid multitasking in thin, portable designs. 

GLOBAL 6 JAN

Rising memory prices set to increase smartphone costs in 2026 - TrendForce

Smartphone manufacturers are likely to face higher memory costs in early 2026 as constrained supply of mobile DRAM and NAND Flash drives price increases across the sector, according to analysts TrendForce. Despite a seasonal slowdown in smartphone memory demand, tight supply conditions mean contract prices for mobile DRAM are unlikely to ease in the near term. Both LPDDR4X and LPDDR5X markets remain undersupplied, with uneven allocation of production capacity, supporting further price rises in the coming qu

GLOBAL 5 JAN

Qualcomm plans expansion in robotics market with new Dragonwing processor

Qualcomm announced robotics as its next area of expansion. At CES in Las Vegas, the chipmaker is demonstrating a new Dragonwing processor for industrial robotics, developed through work with companies such as Figure, Kuka Robotics, Booster and VinMotion. The robotics architecture draws on Qualcomm Technologies' expertise in power efficiency and edge AI performance in smartphones and laptops, with the aim of making possible full-size humanoids for a variety of settings. 

CHINA 2 JAN

Baidu to spin off AI chip business Kunlunxin in Hong Kong listing

Chinese internet group Baidu announced plans to pursue a separate stock market listing for its semiconductor arm Kunlunxin. In an effort to capitalise on the interest in AI stocks, the company will be spun off and listed on the Hong Kong Stock Exchange. The listing should provide Kunlunxin with access to new sources of financing with a broader investor pool and help unlock the value of Baidu's AI businesses, the group said. 

JAPAN 31 DEC 2025

Japan plans 4-fold increase in state support for AI, semiconductors in next fiscal year

The Japanese government has proposed a four-fold increase in state support for the semiconductor and AI sectors in the next fiscal year starting April 2026. That means about JPY 1.23 trillion (USD 7.9 billion) according to the annual budget at the Ministry of Economy, Trade and Industry, the Japan Times reports.

JAPAN 29 DEC 2025

Softbank launches AI computing platform with Nvidia GB200 NVL72 power

SoftBank has taken into use new AI computing resources powered by the Nvidia GB200 NVL72, which the company says marks a major upgrade of Japan's domestic AI infrastructure. The new platform will be used to provide dedicated computing resources powered by Nvidia GPUs for customers and to support the development and commercialization of the company's Japanese large language model, 'Sarashina'. 

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