European Technological Sovereignty Package sets out plans for chips, AI, open source and energy digitisation
EUROPE 14:12

European Technological Sovereignty Package sets out plans for chips, AI, open source and energy digitisation

The European Commission has presented the European Technological Sovereignty Package of measures to strengthen capacity in semiconductors, artificial intelligence (AI), cloud services and open source. The package includes two legislative proposals, namely the Chips Act 2.0 and the Cloud and AI Development Act. It also sets out the Open Source Strategy and the Strategic Roadmap for Digitisation and AI in Energy.

STMicroelectronics raises FY sales forecast for data centre products on strong AI demand
GLOBAL 2 JUN

STMicroelectronics raises FY sales forecast for data centre products on strong AI demand

STMicroelectronics said it anticipates higher FY revenues in its data centre product lines in light of surging AI infrastructure demand and improved supply chain visibility. The firm now anticipates data centre revenues in 2026 will arrive at about USD 1 billion, up from above USD 500 million previously predicted. ST's projection for data centres in FY27 has been lifted accordingly, with revenues now expected to increase twofold to approximately USD 2 billion next year. The company is scheduled to publish i

Morse Micro debuts HaLoW module powered by second-generation RF chip
UNITED STATES 1 JUN

Morse Micro debuts HaLoW module powered by second-generation RF chip

Wi-Fi HaLow silicon specialist Morse Micro is preparing to launch its latest connectivity module based on its latest generation RF chip technology. Set initially for distribution to US and Canadian product teams, the MM8108-M2 is a high-powered module built on Morse Micro's second-generation MM8101 system on a chip. The SoC is coupled with an external power amplifier that transmits at up to 28.5 dBm output power, and a surface acoustic wave (SAW) tuned for 902-928 MHz ISM frequencies as allocated in North A

Nvidia Vera Rubin enters full production as AI factory platform takes shape
GLOBAL 1 JUN

Nvidia Vera Rubin enters full production as AI factory platform takes shape

Nvidia has announced that its Vera Rubin platform is now ramping into full production, with the company positioning the system as a comprehensive end-to-end AI factory platform for cloud providers, hyperscalers and telecoms operators. Designed as a pod-scale system of five purpose-built racks operating as a single AI supercomputer, Vera Rubin claims ten times the agent throughput of the previous Grace Blackwell generation. 

Nvidia and Microsoft bring frontier AI compute to Windows
GLOBAL 1 JUN

Nvidia and Microsoft bring frontier AI compute to Windows

Nvidia has announced two products developed with Microsoft that bring what the two describe as data-centre-class AI capabilities to the Windows desktop for the first time, targeting enterprise developers, data scientists and engineers who currently rely on cloud infrastructure for large model workloads. The flagship product, Nvidia DGX Station for Windows, is a "deskside system" built on the GB300 Grace Blackwell Ultra Desktop Superchip capable of running models up to one trillion parameters locally. 

Qualcomm brings laptop line-up to budget models with Snapdragon C chipset
GLOBAL 29 MEI

Qualcomm brings laptop line-up to budget models with Snapdragon C chipset

Qualcomm is launching an entry-tier laptop computer processor, the Snapdragon C Platform, building on its push into the personal computing space as part of a wider diversification beyond smartphones. Snapdragon C is designed to produce all-day battery life with responsive user feedback in entry-level laptops typically retailing for at least USD 300. It is debuting in an initial cohort of products from OEM partners, including Acer, HP, and Lenovo, with initial retail sell-in anticipated before end-2026.

Mediatek set for Computex showcase starring Wi-Fi 8, 6G and edge computing
GLOBAL 29 MEI

Mediatek set for Computex showcase starring Wi-Fi 8, 6G and edge computing

Mediatek will spotlight its Wi-Fi 8 silicon technology at Computex 2026. The showcase centres on Mediatek's back-compatible Wi-Fi 8 chipset, the Filogic 8800, designed to unlock next-generation performance while also boosting wireless link stability in older Wi-Fi specifications. At peak output, the chip is expected to increase system throughput by about 200 percent and enables file downloads up to 50 percent faster. Filogic 8800 includes a smart Wi-Fi toolkit with optimisation features such as AI Network D

Anthropic nears USD 1 trillion valuation in latest funding round
GLOBAL 29 MEI

Anthropic nears USD 1 trillion valuation in latest funding round

Anthropic announced it has raised USD 65 billion in Series H funding to support the further growth and development of its AI business. The round led by Altimeter Capital, Dragoneer, Greenoaks and Sequoia Capital valued the company at USD 965 billion, again more than doubling its valuation from the previous investment round in February.  

Samsung ships first HBM4E samples
GLOBAL 29 MEI

Samsung ships first HBM4E samples

Samsung Electronics has begun shipping what it describes as the industry's first 12-layer HBM4E memory samples to major global customers, extending its next-generation high-bandwidth memory roadmap amid rapidly rising demand for AI infrastructure. The company said the new HBM4E product builds on its earlier commercialisation of HBM4 and is designed to support increasingly demanding AI workloads, including large language models and hyperscale computing systems.

Agentic AI to push global memory market past USD 1.28 tn by 2027 - TrendForce
GLOBAL 29 MEI

Agentic AI to push global memory market past USD 1.28 tn by 2027 - TrendForce

Market analyst TrendForce has sharply raised its forecasts for the global memory industry, arguing that the rise of inference-heavy Agentic AI workloads is creating a structural surge in demand for DRAM and NAND flash that could push the market beyond USD 1.28 trillion by 2027. It said the AI industry's transition from large-scale model training toward inference-centric autonomous AI agents is fundamentally changing memory consumption patterns. 

Arm open-sources AI security framework for software vulnerability detection
GLOBAL 29 MEI

Arm open-sources AI security framework for software vulnerability detection

Arm has open-sourced an AI-based security analysis framework designed to improve the detection of software vulnerabilities across large-scale codebases. The framework, called Metis, has been developed by Arm's product security team and is currently being used internally across more than 130 software projects, with wider deployment planned across the company by the end of 2026. Metis is designed to identify complex security vulnerabilities that may span multiple software components, systems or layers and whi

IQE closes strategic funds to pay off debt as FY sales trend lower
GLOBAL 28 MEI

IQE closes strategic funds to pay off debt as FY sales trend lower

Chip wafer supplier IQE has tied up an GBP 81 million strategic fundraising announced in April to pay off debt obligations. The transaction raised GBP 45 million from equity and non-interest bearing convertible notes, issued to strategic investor Macom Technology Solutions. The remaining funds were sourced through a GBP 23 million redemption and reinvestment of existing convertibles, and through a GBP 13 million placing and retail offer. Net proceeds from the fundraising should reach GBP 27.9 million, follo

GLOBAL 28 MEI

Broadcom joins Samsung to launch Wi-Fi 8 FWA silicon archetype

Broadcom has partnered with Samsung to introduce a fixed wireless access (FWA) reference architecture pairing its Wi-Fi 8 system-on-chip with Samsung's B1320 5G modem. The collaboration aims to catalyse a benchmark for FWA services optimised for the emerging Wi-Fi 8 standard and the 3GPP's Release 17 specification. Broadcom expects this approach to facilitate service differentiation as mobile operators strive to expand fibre-grade FWA offerings, delivering a viable pathway to mass-market scalability and cos

GLOBAL 28 MEI

GCT boosts 5G silicon roadmap with MaxLinear AnyWAN collaboration

GCT Semiconductor has teamed up with MaxLinear to deliver a presentation at Computex on integrated fixed wireless access (FWA) and multi-WAN gateways. The showcase reflects a newly announced strategic partnership between the companies that looks set to further GCT's 5G silicon ramp-up. The partners have pooled resources to introduce a pre-integrated technology solution coupling MaxLinear's Wi-Fi AnyWAN system-on-chip with GCT's cellular modem.

GLOBAL 28 MEI

Marvell Technology improves sales outlook for next 2 years on data centre networking demand

Marvell Technology announced a big increase in its expected sales in fiscal 2027 and 2028 alongside its Q127 figures, thanks to strong demand for its data centre networking products. The company's revenues for the three months to April rose 28 percent year-on-year to USD 2.418 billion and it forecast 35 percent growth in fiscal Q2. Marvell said growth is expected to accelerate each quarter this year and reach around 40 percent for the full year. 

GLOBAL 27 MEI

MaxLinear and Edgecore collaborate on edge intelligence connectivity

MaxLinear and Edgecore Networks have reached a strategic agreement to market an integrated networking solution that executes AI compute closer to the source of data generation in enterprise networks. The co-operation pairs MaxLinear's connectivity platforms and Edgecore's open networking products with a focus on AI-infused workloads. MaxLinear's contribution is based on its multi-interface WAN silicon platform that harmonises XGS-PON, Ethernet, and Wi-Fi access, facilitating sustained 10 Gbps data throughpu

GLOBAL 27 MEI

Semtech restores profitability in Q1 with sales up 16%

Semtech posted a USD 26.6 million net profit in the fiscal first quarter to end-April, reversing a USD 29.8 million loss in the final quarter of FY26 that was attributed to goodwill writedowns. Group sales of USD 291 million arrived ahead of Semtech's prior USD 278-288 million target, and were up by around 16 percent year-on-year, amid growth in all of the vendor's operating units. Signal integrity silicon sales lifted 39 percent to USD 102 million, while analogue mixed signal and wireless chips grew 11.3 p

SPAIN 27 MEI

Quantix to build USD 40 mln semiconductor design centre in Murcia

Quantix Edge Security said it has selected the municipality of Murcia in southeastern Spain as the site for a new semiconductor design centre, following a review of 25 proposals from 15 municipalities. The company plans to invest around USD 40 million in the facility, which will focus on the design, testing, personalisation and security of semiconductors for sectors including defence, critical infrastructure, automotive and the Internet of Things.

JAPAN 27 MEI

NTT integrates optical network monitoring capability into DSP chip

NTT said it has developed and demonstrated what it describes as the first integration of end-to-end optical network monitoring functionality into a communications digital signal processor (DSP) chip, enabling optical transceivers to detect and locate network anomalies without requiring dedicated measurement equipment. The operator said the technology allows a compact optical transceiver at the receiving end of a network to monitor the condition of an optical path while traffic is being carried, providing vi

UNITED STATES 25 MEI

Micron fires up US DRAM production node

Memory chip vendor Micron Technology is marking first production for a US manufacturing process targeted at DRAM components. The first US production lines deploying Micron's 1-alpha process are now active in its fabrication facility in Manassas, Virginia. The 1-alpha node is expected to satisfy demand for extended lifecycle memory use cases, including DDR4 and LP4-grade DRAM used in networking, automotive, defence and aerospace, medical devices, and industrial equipment. It is described as the "most advance

CHINA 25 MEI

Huawei outlines strategy to boost chip performance amid US sanctions

Huawei president for semiconductors He Tingbo has given a keynote speech on the Chinese vendor's strategy for scaling transistor density on silicon chips. The speech is regarded as a significant insight into Huawei's plans to circumvent tech bottlenecks created by US sanctions that have barred access to EUV (extreme ultraviolet) lithography machines supplied by Dutch vendor ASML, which controls the vast majority of the market. The company believes its framework, dubbed the Tau Scaling Law, will allow it to

FRANCE 25 MEI

France pledges EUR 1.5 bln in new funds towards quantum and advanced microchips

French president Emmanuel Macron announced further investment to advance the country's capabilities in two sectors seen as critical to national sovereignty. An additional EUR 1 billion via the 'France 2030' programme will support the quantum strategy, while EUR 550 million will contribute to a wider European initiative focused on AST (Advanced Semiconductor Technologies). Macron used a speech on 22 May to reassert his conviction that French and European spending in these strategic sectors must increase "mas

GLOBAL 25 MEI

Via Licensing calls for partners in NAND patent pool

Via Licensing is introducing a new NAND memory licensing programme, as part of efforts to expand in the data centre and AI infrastructure market. Garrard Beeney, a leader of Sullivan & Cromwell's IP practice for over two decades, was hired to serve as licensing counsel for Via's data centre efforts. 

EUROPE 21 MEI

LMT IoT, Infineon partner on connected edge AI product development

Latvian company LMT IoT, a member of the LMT Group, and Infineon Technologies announced a new cooperation aimed at helping startups and product companies develop, deploy and scale connected edge AI products more efficiently. At the centre of the new cooperation between the two European companies sits Infineon's edge AI technologies, including Deepcraft software, with the IoT Shortcut connectivity platform from LMT IoT. The goal is to give developers a clearer path from working AI models to deployable, conne

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